mmsz5259b page: 1 frontier electronics corp. 667 e. cochran street, simi valley, ca 93065 tel: (805) 522-9998 fax: (805) 522-9989 e-mail: frontiersales@frontierusa.com web: http://www.frontierusa.com zener diodes mmsz5221b thru mmsz5259b features z planar die construction z ultra-small surface mount package z general purpose, medium current z ideally suited for autom ated assembly processes case: sod-123 unit:mm maximum ratings ( t amb =25 unless otherwise specified ) characteristic symbol value unit forward voltage i f =10ma v f 0.9 v power dissipation (note1) p d 350 mw thermal resistance , junction to ambient air (note1) r ja 357 k/w operating and storage temperature range t j,tstg - 65 to + 150 note: 1. valid provided that device ter minals are kept at ambient temperature. 2. tested with pulses , tp Q 1.0ms
mmsz5259b page: 2 electrical characteristics (a t t a =25 c unless otherwise specified) zener voltage range (note 2) maximum zener impedance maximum reverse leakage current vz@izt izt zzt@izt zzk@izk izk ir vr type number type code nom(v) min(v) max(v) ma ma ua v mmsz5221b mmsz5223b mmsz5225b mmsz5226b mmsz5227b mmsz5228b mmsz5229b mmsz5230b mmsz5231b mmsz5232b mmsz5233b mmsz5234b mmsz5235b mmsz5236b mmsz5237b mmsz5238b mmsz5239b mmsz5240b mmsz5241b mmsz5242b mmsz5243b mmsz5245b mmsz5246b MMSZ5248B mmsz5250b mmsz5251b mmsz5252b mmsz5254b mmsz5255b mmsz5256b mmsz5257b mmsz5258b mmsz5259b c1 c3 c5 g1 g2 g3 g4 g5 e1 e2 e3 e4 e5 f1 f2 f3 f4 f5 h1 h2 h3 h5 j1 j3 j5 k1 k2 k4 k5 m1 m2 m3 m4 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.0 6.2 6.8 7.5 8.2 8.7 9.1 10 11 12 13 15 16 18 20 22 24 27 28 30 33 36 39 2.28 2.57 2.85 3.14 3.42 3.71 4.09 4.47 4.85 5.32 5.70 5.89 6.46 7.13 7.79 8.27 8.65 9.50 10.45 11.40 12.35 14.25 15.20 17.10 19.00 20.90 22.80 25.65 26.60 28.50 31.35 34.20 37.05 2.52 2.84 3.15 3.47 3.78 4.10 4.52 4.94 5.36 5.88 6.30 6.51 7.14 7.88 8.61 9.14 9.56 10.50 11.55 12.60 13.65 15.75 16.80 18.90 21.00 23.10 25.20 28.35 29.40 31.50 34.65 37.80 40.95 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 9.5 8.5 7.8 7.0 6.2 5.6 5.2 5.0 4.5 4.2 3.8 3.4 3.2 30 30 30 28 24 23 22 19 17 11 7 7 5 6 8 8 10 17 22 30 13 16 17 21 25 29 33 41 44 49 58 70 80 1200 1300 1600 1600 1700 1900 2000 1900 1600 1600 1600 1000 750 500 500 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 700 700 800 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 100 75 50 25 15 10 5.0 5.0 5.0 5.0 5.0 5.0 3.0 3.0 3.0 3.0 3.0 3.0 2.0 1.0 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.0 6.0 6.5 6.5 7.0 8.0 8.4 9.1 9.9 11 12 14 15 17 18 21 21 23 25 27 30 note: 1. device mounted on ceramic pcb 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm 2 . 2. tested with pulses , tp Q 1.0ms. power dissipation (w) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 25 50 75 100 125 150 175 ambient temperature ( o c) fig. 1 ?forward dissipation vs ambient temperature
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